Burn-in System

The youth, developments and enterprises, they see far and act a lot.

{GROUP_xml_flex_b}은 존재하지 않는 그룹디자인 입니다.../font>
  • 번인시스템 - LC-2

    Low Cost Burn-In Systems for Logic Devices

    - Provides burn-in for a variety of device types, including ASICs, FPGAs, video processors, and communication ICs.
    - Individual temperature control for each device under test up to 20 W.
    - Large system capacity (64 burn-in boards).
    - 128 digital I/O channels per burn-in board.
    - Per-pin timing, testing, and formatting.
    - Accepts burn-in boards up to 12 1/2" by 24".
    - 16 pattern zones.
    - Up to 250 amps of programmable power to the burn-in board.

  • 번인시스템 - HPB-5C

    High-Power Burn-In Systems Up to 150 Watts

    - Individual temperature control for each device under test up to 150W.
    - Individual pattern zone per burn-in board.
    - 24 temperature channels.
    - Up to 128 digital I/O channels per burn-in board.
    - 32M or 64M vector memory, reconfigurable scan vectors up to 8G.
    - Programmable temperature control up to 150° C.
    - 16 programmable voltage regulators per burn-in board.
    - 1080 amps of DUT power available per burn-in board.
    - FPGA architecture for per-pin timing, testing, and formatting of pattern data.
    - 8 on-the-fly timing sets.
    - System capacity up to 384 devices with active thermal control.

  • 번인시스템 - HPB-4

    High-Power Burn-In Up to 600 Watts

    - Individual temperature control for each device under test up to 600 W.
    - Tests devices at a maximum temperature of 150° C.
    - Up to 128 digital I/O channels per burn-in board.
    - 16 programmable voltage regulators per burn-in board.
    - 1600 amps of DUT power available per burn-in board.
    - Liquid-cooled heat sink per device under test.
    - Voltage regulator power clamp mode.
    - System capacity up to 112 devices.